Hexafluoroethane

Hexafluoroethane

Hexafluoroethane (C2F6) is used in plasma etching of silicon dioxide, CVD chamber cleaning, and as a dielectric gas in electronics. CAS: 76-16-4.

Category: High-Purity Gases

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Product Details

Product Overview

PropertyValue
Product NameHexafluoroethane C2F6
CAS No.76-16-4
UN NumberUN2193
Purity99.9% / 99.999%
Packing40L cylinder (GB, ISO, DOT)
Filling Content40kg/cyl

Transportation

PropertyValue
DOT Shipping NameHexafluoroethane
DOT Classification2.2
DOT LabelNonflammable Gas
Shipped asLiquefied Gas

Technical Information

PropertyValue
Cylinder State @ 21.1°CLiquid
Molecular Weight138.01 g/mol
Specific Gravity (air=1)4.76
Critical Temperature19.7 °C
Flammable Limits in AirNon-flammable

Applications

Hexafluoroethane (C2F6) is used in the semiconductor industry for plasma etching and CVD chamber cleaning. It is also used as a low-temperature refrigerant and cryogenic applications. In the electronics industry, C2F6 is used for dielectric etching of silicon dioxide and silicon nitride layers.