Octafluorocyclobutane

Octafluorocyclobutane

Halocarbon C318 - Octafluorocyclobutane (C4F8) is used in semiconductor manufacturing for plasma etching of silicon dioxide or silicon layers. Purity: 99.9%-99.999%. CAS: 115-25-3, UN: UN1976.

Category: High-Purity Gases

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Product Details

Product Overview

PropertyValue
Product NameHalocarbon C318 - Octafluorocyclobutane C4F8
CAS Number115-25-3
UN NumberUN 1976
Packing40L, 44L, 47L, 50L cylinder (GB, ISO, DOT)
Filling Content40kg/cyl
Shipped asLiquefied Gas

Specifications

Items99.9%99.999%
C4F899.9%99.999%
O2≤80 ppmv≤1.0 ppmv
N2≤300 ppmv≤3.0 ppmv
CO2≤50 ppmv≤0.5 ppmv
CO≤30 ppmv≤0.5 ppmv
CH4≤30 ppmv≤0.5 ppmv
H2O≤10 ppmv≤3.0 ppmv
Other Organics≤600 ppmv≤5.0 ppmv
Acidity as HCl≤1.0 ppmw≤0.1 ppmw

Transportation & Technical Information

DOT Classification2.2 - Nonflammable Gas
CGA/DISS/JIS660/716/W22-14L
Molecular Weight200.03 g/mol
Specific Gravity (air=1)7.33
Critical Temperature115.2 °C

Applications

Perfluorocyclobutane (C4F8) is used in semiconductor manufacturing as plasma etching of silicon dioxide (SiO2) or silicon layers.